Time:2025-11-27 Views:1
Mobile terminals—including smartphones, tablets, and IoT devices—rely on coaxial terminals (also called coaxial connectors) to facilitate high-speed signal transmission between internal components (e.g., antennas, RF chips, and modems) and external networks. In the era of 5G and emerging 6G technologies, these terminals face stringent requirements: miniaturization (to fit compact device layouts), high-frequency compatibility (up to 40 GHz for 5G mmWave), low insertion loss (<0.3dB), and robust mechanical stability (to withstand daily wear, temperature cycles, and vibration). A well-designed coaxial terminal ensures seamless connectivity, minimizes signal degradation, and supports key mobile functions like ultra-fast data streaming, low-latency gaming, and reliable IoT sensor communication.
Common coaxial terminal designs for mobile devices include micro-miniature versions of standard connectors, such as SMA (SubMiniature version A), SMB (SubMiniature B), and U.FL (Ultra-Fast Lock) connectors—with U.FL being particularly popular due to its ultra-compact size (as small as 2.5mm × 1.8mm). These terminals feature precision-engineered inner conductors, dielectric sleeves (often made of LCP or PPS for thermal stability), and outer shells (typically brass or stainless steel for shielding against electromagnetic interference (EMI)). However, challenges persist: miniaturization can compromise mechanical strength, leading to connector detachment or increased contact resistance over time. Additionally, 5G mmWave frequencies require tighter manufacturing tolerances (e.g., ±0.01mm for conductor spacing) to avoid impedance mismatches, increasing production costs. To address these issues, manufacturers are adopting hybrid materials (e.g., metal-plastic composites) for lightweight yet durable shells, and developing self-locking mechanisms to improve connector retention. Advanced EMI shielding techniques, such as multi-layered metal coatings or ferrite beads integrated into terminals, also help reduce cross-talk between adjacent components, ensuring mobile devices meet strict regulatory standards for signal integrity and electromagnetic compatibility (EMC).
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